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  d a t a sh eet product speci?cation file under integrated circuits, ic01 may 1990 integrated circuits TEA6300 TEA6300t sound fader control circuit
may 1990 2 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t general description the sound fader control circuit (sofac) is an i 2 c-bus controlled preamplifier for car radios. features source selector for three stereo inputs inputs and outputs for noise reduction circuits volume and balance control; control range of 86 db in steps of 2 db bass and treble control from + 15 db (treble 12 db) to - 12 db in steps of 3 db fader control from 0 db to - 30 db in steps of 2 db fast muting low noise suitable for dolby* b and c nr (noise reduction) signal handling suitable for compact disc i 2 c-bus control for all functions esd protected quick reference data * dolby is a registered trademark of dolby laboratories licensing corporation, san francisco, california (u.s.a.). package outlines 28-lead dual in-line; plastic (sot117); sot117-1; 1996 august 15. 28-lead mini-pack; plastic (so28; sot136a); sot136-1; 1996 august 15. symbol parameter min. typ. max. unit v cc supply voltage 7,0 8,5 13,2 v v i(rms) input sensitivity for full power at the output stage - 50 - mv v i(rms) input signal handling - 1,65 - v f r frequency response 35 - 20 000 hz a cs channel separation; f = 250 hz to 10 khz 70 92 - db thd total harmonic distortion - 0,05 - % (s + n)/n signal plus noise-to-noise ratio - 80 - db t amb operating ambient temperature range - 40 -+ 85 c
may 1990 3 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here in this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force land scape pages to be ... fig.1 block diagram.
may 1990 4 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t pinning 1 sda serial data input/output (i 2 c-bus) 2 gndb ground for i 2 c-bus terminals 3 qlr output left rear 4 qlf output left front 5 tl treble control capacitor; left channel 6 bl1 bass control capacitor; left channel 7 bl0 bass control capacitor; left channel 8 inla input left source a 9 i.c. internally connected 10 inlb input left source b 11 elfi electronic ?ltering for supply 12 inlc input left source c 13 qsl output source selector left 14 inl input left control part 15 inr input right control part 16 qsr output source selector right 17 inrc input right source c 18 gnd ground 19 inrb input right source b 20 v ref reference voltage (1/2 v cc ) 21 inra input right source a 22 bro bass control capacitor; right channel 23 br1 bass control capacitor; right channel 24 tr treble control capacitor; right channel 25 qrf output right front 26 qrr output right rear 27 v cc supply voltage 28 scl serial clock input (i 2 c-bus) fig.2 pinning diagram.
may 1990 5 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t functional description the source selector selects three stereo channels - rf part (am/fm), recorder and compact disc. as the outputs of the source selector and the inputs of the main control part are available, additional circuits such as compander and equalizer systems may be inserted into the signal path. the ac signal setting is performed by resistor chains in combination with multi-input operational amplifiers. the advantage of this principle is the combination of low noise, low distortion and a high dynamic range for the circuit. the separate volume controls of the left and the right channel facilitate correct balance control. the range and balance control is software programmable. because the TEA6300 has four outputs a low-level fader is included. the fader control is independent of the volume control and an extra mute position is built in for the front, the rear or for all channels. the last function may be used for muting during preset selection. an extra pop suppression circuit is built in for pop-free switching on and off. as all switching and control functions are controllable via the two-wire i 2 c-bus, no external interface between the microcomputer and the TEA6300 is required. the on-chip power-on-reset sets the TEA6300 to the general mute mode. ratings limiting values in accordance with the absolute maximum system (iec 134) symbol parameter min. max. unit v cc supply voltage (pin 27-18) - 16 v p tot maximum power dissipation - 1w t stg storage temperature range - 55 + 150 c t amb operating ambient temperature range - 40 + 85 c
may 1990 6 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t characteristics v cc = 8,5 v; r s = 600 w ; r l = 10 k w ; f = 1 khz; t amb = 25 c; test circuit fig.10; unless otherwise speci?ed symbol parameter min. typ. max. unit v cc supply voltage 7,0 8,5 13,2 v i cc supply current - 26 - ma i cc supply current at 8,5 v -- 33 ma i cc supply current at 13,2 v -- 44 ma dc voltage v dc inputs, outputs and reference 0,45 0,5 0,55 v cc internal reference voltage (pin 20) v ref v ref = 0,5 v cc - 4,25 - v maximum voltage gain g v bass and treble linear, fader off 19 20 21 db output voltage level v o(rms) for p max at the output stage - 500 - mv v o(rms) for start of clipping - 1000 - mv input sensitivity v i(rms) at v o = 500 mv - 50 - mv frequency response bass and treble linear; roll-off f r frequency - 1 db 35 - 20 000 hz channel separation g v = 0 db; bass and treble linear; a cs frequency range 250 hz to 10 khz 70 92 - db total harmonic distortion frequency range 20 hz to 12,5 khz thd v i = 50 mv; g v = 20 db - 0,1 0,3 % thd v i = 500 mv; g v = 0 db - 0,05 0,2 % thd v i = 1,6 v; g v = - 10 db - 0,2 0,5 % ripple rejection v r(rms) < 200 mv; g v = 0 db; bass and treble linear; rr 100 at f = 100 hz - 70 - db rr range at f = 40 hz to 12,5 khz - 60 - db
may 1990 7 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t signal plus noise-to-noise ratio bass and treble linear; notes 1 and 2 ccir 468-2 weighted; quasi peak (s + n)/n v i = 50 mv; v o = 46 mv; p o = 50 mw - 65 - db (s + n)/n v i = 500 mv; v o = 45 mv; p o = 50 mw - 67 - db (s + n)/n v i = 50 mv; v o = 200 mv; p o = 1 w 65 70 - db (s + n)/n v i = 500 mv; v o = 200 mv; p o = 1 w 65 78 - db (s + n)/n v i = 50 mv; v o = 500 mv; p o = 6 w - 70 - db (s + n)/n v i = 500 mv; v o = 500 mv; p o = 6 w - 85 - db noise output power mute position, only contribution of p no TEA6300; power amplifier for 25 w -- 10 nw crosstalk (20 log v bus(p-p) /v o(rms) ) between bus inputs and signal outputs a b g v = 0 db; bass and treble linear - 110 - db source selector z i input impedance 20 30 40 k w z o output impedance -- 100 w r l output load resistance 10 -- k w c l output load capacity 0 - 200 pf input isolation not selected source; frequency range a s 40 hz to 12,5 khz - 80 - db voltage gain g v r l 3 10 k w- 0 - db v b int /v ref internal bias voltage ratio - 1 - maximum input voltage level (rms value) v i(rms) thd < 0,5% - 1,65 - v v i(rms) thd < 0,5%; v cc = 7,5 v - 1,5 - v total harmonic distortion thd v i = 500 mv; r l = 10 k w-- 0,1 % noise output voltage v no weighted ccir 468-2, quasi peak - 920 m v dc offset voltage v o between any inputs -- 10 mv symbol parameter min. typ. max. unit
may 1990 8 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t control part source selector disconnected, source resistance 600 w z i input impedance 35 50 65 k w z o output impedance - 100 150 w r l output load resistance 5 -- k w c l output load capacity 0 - 2500 pf maximum input voltage thd < 0,5%; g v = - 10 db; v i(rms) bass and treble linear - 2,0 - v noise output voltage weighted acc ccir 468-2, quasi-peak, bass and treble linear, fader off v no g v = 20 db - 110 220 m v v no g v = 0 db - 25 50 m v v no g v = - 66 db - 19 38 m v v no mute position - 11 22 m v volume control g c continuous control range - 86 - db step resolution - 2 - db attenuator set error d g a (g v = + 20 to - 50 db) -- 2db attenuator set error d g a (g v = + 20 to - 66 db) -- 3db gain tracking error balance in mid position, d g t bass and treble linear -- 2db a m mute attenuation 72 90 - db dc step offset between any adjoining step and any step to mute g v = 0 to - 66 db - 0,2 10 mv g v = 20 to 0 db - 215mv in any treble and fader position g v = 0 to - 66 db -- 10 mv in any bass position g v = 0 to - 66 db -- 20 mv symbol parameter min. typ. max. unit
may 1990 9 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t notes to the characteristics 1. the indicated values for output power assume a 6 w power amplifier with 20 db gain, connected to the output of the bass control bass control range g b f = 40 hz; maximum boost 14 15 16 db g b f = 40 hz; maximum attenuation 11 12 13 db step resolution - 3 - db step error -- 0,5 db treble control treble control range g t f = 15 khz; maximum boost 11 12 13 db g t f = 15 khz; maximum attenuation 11 12 13 db g t f > 15 khz; maximum boost -- 15 db step resolution - 3 - db step error -- 0,5 db fader control continuous attenuation g f fader control range - 30 - db step resolution - 2 - db attenuator set error -- 1,5 db a m mute attenuation 74 84 - db digital part bus terminals input voltage v ih high 3 - 12 v v il low - 0,3 -+ 1,5 v input current i ih high - 10 -+ 10 m a i il low - 10 -+ 10 m a v ol output voltage low; i l = 3 ma -- 0,4 v ac characteristics in accordance with the i2c-bus speci?cation power-on-reset when reset is active the gmu (general mute) bit is set and the i 2 c-bus receiver is in reset position increasing supply voltage v cc start of reset -- 2,5 v v cc end of reset 5,2 6,0 6,8 v v cc decreasing supply voltage; start of reset 4,2 5,0 5,8 v symbol parameter min. typ. max. unit
may 1990 10 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t circuit. signal-to-noise ratios exclude noise contribution of the power amplifier. 2. signal-to-noise ratios on a ccir 468-2 average meter reading are 4,5 db better than on ccir 468-2 quasi peak. i 2 c-bus format if more than 1 byte of data is transmitted, then auto-increment of the subaddress is performed. table 1 i 2 c-bus; subaddress/data s slave address a subaddress a data a p s = start condition subaddress = see table 1 slave address = 1000 0000 data = see table 1 a = acknowledge, generated by the slave p = stop condition function subaddress data d7 d6 d5 d4 d3 d2 d1 d0 volume left 0 0 0 0 0 0 0 0 x x vl5 vl4 vl3 vl2 vl1 vl0 volume right 0 0 0 0 0 0 0 1 x x vr5 vr4 vr3 vr2 vr1 vr0 bass 0 0 0 0 0 0 1 0 x x x x ba3 ba2 ba1 ba0 treble 0 0 0 0 0 0 1 1 x x x x tr3 tr2 tr1 tr0 fader 0 0 0 0 0 1 0 0 x x mfn fch fa3 fa2 fa1 fa0 switch 0 0 0 0 0 1 0 1 gmu xxxxsccscbsca function of the bits: vl0 to vl5 volume control left vr0 to vr5 volume control right ba0 to ba3 bass control tr0 to tr3 treble control fa0 to fa3 fader control fch select fader channel (front or rear) mfn mute control of the selected fader channel (front or rear) sca to scc source selector control gmu mute control (general mute) for the outputs qlf, qlr, qrf and qrr x don't care bits (logic 1 during testing)
may 1990 11 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t table 2 bass setting g v data db ba3 ba2 ba1 ba0 + 15 1 1 1 1 + 15 1 1 1 0 + 15 1 1 0 1 + 15 1 1 0 0 + 12 1 0 1 1 + 91010 + 61001 + 31000 00111 - 30110 - 60101 - 90100 - 12 0 0 1 1 - 12 0 0 1 0 - 12 0 0 0 1 - 12 0 0 0 0 table 3 treble setting g v data db tr3 tr2 tr1 tr0 + 12 1 1 1 1 + 12 1 1 1 0 + 12 1 1 0 1 + 12 1 1 0 0 + 12 1 0 1 1 + 91010 + 61001 + 31000 00111 - 30110 - 60101 - 90100 - 12 0 0 1 1 - 12 0 0 1 0 - 12 0 0 0 1 - 12 0 0 0 0
may 1990 12 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t table 4 volume setting left g v data db vl5 vl4 vl3 vl2 vl1 vl0 20 111111 18 111110 16 111101 14 111100 12 111011 10 111010 8 111001 6 111000 4 110111 2 110110 0 110101 - 2 110100 - 4 110011 - 6 110010 - 8 110001 - 10 110000 - 12 101111 - 14 101110 - 16 101101 - 18 101100 - 20 101011 - 22 101010 - 24 101001 - 26 101000 - 28 100111 - 30 100110 - 32 100101 - 34 100100 - 36 100011 - 38 100010 - 40 100001 - 42 100000 - 44 011111 - 46 011110 - 48 011101 - 50 011100 - 52 011011 - 54 011010 - 56 011001 - 58 011000 - 60 010111 - 62 010110 - 64 010101 - 66 010100 mute left 010011 mute left 010010 .. .. .. mute left 000000 g v data db vl5 vl4 vl3 vl2 vl1 vl0
may 1990 13 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t table 5 volume setting right g v data db vr5 vr4 vr3 vr2 vr1 vr0 20 111111 18 111110 16 111101 14 111100 12 111011 10 111010 8 111001 6 111000 4 110111 2 110110 0 110101 - 2 110100 - 4 110011 - 6 110010 - 8 110001 - 10 110000 - 12 101111 - 14 101110 - 16 101101 - 18 101100 - 20 101011 - 22 101010 - 24 101001 - 26 101000 - 28 100111 - 30 100110 - 32 100101 - 34 100100 - 36 100011 - 38 100010 - 40 100001 - 42 100000 - 44 011111 - 46 011110 - 48 011101 - 50 011100 - 52 011011 - 54 011010 - 56 011001 - 58 011000 - 60 010111 - 62 010110 - 64 010101 - 66 010100 mute right 010011 mute right 010010 .. .. .. mute right 000000 g v data db vr5 vr4 vr3 vr2 vr1 vr0
may 1990 14 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t table 6 fader function setting data front rear db db mfn fch fa3 fa2 fa1 fa0 fader off 0 0 1 11111 0 0 0 11111 fader front - 2 0 1 11110 - 4 0 1 11101 - 6 0 1 11100 - 8 0 1 11011 - 10 0 1 11010 - 12 0 1 11001 - 14 0 1 11000 - 16 0 1 10111 - 18 0 1 10110 - 20 0 1 10101 - 22 0 1 10100 - 24 0 1 10011 - 26 0 1 10010 - 28 0 1 10001 - 30 0 1 10000 mute front - 80 0 0 11110 .. . .. . .. . - 80 0 0 10000 fader off 0 0 1 01111 0 0 0 01111 fader rear 0 - 2 1 01110 0 - 4 1 01101 0 - 6 1 01100 0 - 8 1 01011 0 - 101 01010 0 - 121 01001 0 - 141 01000 0 - 161 00111 0 - 181 00110 0 - 201 00101 0 - 221 00100 0 - 241 00011 0 - 261 00010 0 - 281 00001 0 - 301 00000 mute rear 0 - 800 01110 .. . .. . .. . 0 - 800 00000 setting data front rear db db mfn fch fa3 fa2 fa1 fa0 table 7 selected inputs selected inputs data scc scb sca data not allowed 1 1 1 data not allowed 1 1 0 data not allowed 1 0 1 inlc, inrc 1 0 0 data not allowed 0 1 1 inlb, inrb 0 1 0 inla, inra 0 0 1 data not allowed 0 0 0 table 8 mute control mute data remarks control gmu active 1 outputs qlf, qlr qrf and qrr are muted passive 0 no general mute
may 1990 15 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t fig.3 bass control without t-pass filter. fig.4 bass control with t-pass filter. fig.5 t-pass filter. pin numbers in parentheses refer to the bass control, right channel.
may 1990 16 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t fig.6 treble control. fig.7 output noise voltage (ccir 468-2 weighted: quasi peak).
may 1990 17 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t fig.8 signal-to-noise ratio (ccit 468-2 weighted; quasi peak) with a 6 w power amplifier (gain 20 db) without noise contribution of the power amplifier (see fig.9). fig.9 recommended level diagram; v i min = 50 mv, v o = 500 mv for p max .
may 1990 18 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t application information fig.10 test and application circuit.
may 1990 19 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t package outlines unit a max. 1 2 b 1 (1) (1) (1) cd e w em h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot117-1 92-11-17 95-01-14 a min. a max. b z max. m e e 1 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 3.9 3.4 0.25 2.54 15.24 15.80 15.24 17.15 15.90 1.7 5.1 0.51 4.0 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.15 0.13 0.01 0.10 0.60 0.62 0.60 0.68 0.63 0.067 0.20 0.020 0.16 051g05 mo-015ah m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 28 1 15 14 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. handbook, full pagewidth dip28: plastic dual in-line package; 28 leads (600 mil) sot117-1
may 1990 20 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot136-1 x 14 28 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a e 15 1 (a ) 3 a y 0.25 075e06 ms-013ae pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale so28: plastic small outline package; 28 leads; body width 7.5 mm sot136-1 95-01-24 97-05-22
may 1990 21 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so r eflow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
may 1990 22 philips semiconductors product speci?cation sound fader control circuit TEA6300 TEA6300t definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.


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